Hynix is ​​optimistic about memory prices rebound Taiwan factory injection

South Korea's memory maker Hynix has expressed its views on the bottom of the DRAM and NAND Flash industry. It is expected that the DRAM maker in Taiwan will intensify its efforts. In the silicon wafer sector, Hynix and Taiwan Plants currently have stocks ranging from 1 to 2 months, which can still be produced in short-term. However, in the long-term perspective, the shortage of silicon wafers caused by the Japan earthquake remains to be clarified. Currently, the market is buying. Most of the time, as we walked and watched, there was no rush to grab the goods, but we also feared that the tight supply would cause price increases in the future.

After the earthquake in Japan, various DRAM manufacturers all increased their selling prices, and the market buying intensity was moderate. There was no rush to buy goods. In the DRAM industry where the supply was in excess demand, all the players believed that the DRAM price would gradually bottom out. Micron CEO Steve Appleton also said recently that he expects DRAM quotes from March to May will fall to the bottom. On the 30th, Hynix’s president, Wu Zhe, echoed that memory prices will gradually fall to the bottom.

In terms of silicon wafers, Hynix believes that current inventory still lasts for about 45 days and will not be affected in the short term; Taiwanese manufacturers believe that current inventory levels are maintained at 1 to 2 months, and that this is not a problem in the short term, but it will not be a problem in the short-term. Look, no one company dares to hang on to ensure long-term supply will not be determined, because the two major silicon wafer fabs still announced the complete return of work, so the real supply pressure will emerge after May.

In the Taiwanese DRAM factory, Nanyake and Inako rely mainly on Formosa Plastics and Sumco’s joint-venture Taiwan Seiketsu to supply silicon wafers, which are relatively safe to supply. In the Elpida camp, they rely mainly on this Shinitsu Semiconductor, which has been severely affected by Japan's strong earthquakes, and EPI Wafer, which uses high-end processes, are currently seeking support from other silicon wafer suppliers.

Although affected by the earthquake in Japan, Samsung Electronics and Hynix have continued to progress in the miniaturization of the process. Samsung will account for more than 50% of the 30-nm manufacturing process in the second half of 2011. Hynix also said that the end of 2011 30-nanometer process The proportion will increase to 40%, and the two companies will also continue to develop 20-nanometer processes. It is expected that the 20-nanometer process will come into mass production in 2012.

The Taiwan factory will be slightly later than Samsung and other large factories in the process of miniaturization of the process. In the middle of 2011, it will introduce 30-nanometer manufacturing processes one after another. Among them, Nanyake and UCAB will jointly transfer to Micron the 37-nanometer process. Elpida and Ruijing will also enter into the 30-nanometer process in 2011, further driving down the cost.

The industry believes that after the strong earthquake in Japan, although all plants were affected by the supply of silicon wafers and chemical materials, compared to the fact that Korean-based memory plants were less affected, Taiwan was linked to Japanese companies. It is relatively high, so it will be affected somewhat; Hynix said that it can take this opportunity to gradually increase the market share of global city memory.